• 500L Nitrogen-Filled Drying Oven for Silicon Chip
  • 500L Nitrogen-Filled Drying Oven for Silicon Chip
  • 500L Nitrogen-Filled Drying Oven for Silicon Chip
  • 500L Nitrogen-Filled Drying Oven for Silicon Chip
  • 500L Nitrogen-Filled Drying Oven for Silicon Chip
  • 500L Nitrogen-Filled Drying Oven for Silicon Chip

500L Nitrogen-Filled Drying Oven for Silicon Chip

After-sales Service: 1 Year
Power Supply: AC 380V/220V
Certification: CE, TUV, ISO
Warranty: 1 Year
Power: 3kw
Control Range: 60ºC-200ºC
Customization:
Manufacturer/Factory & Trading Company

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  • Overview
  • Product Description
  • Features
  • Product Parameters
  • Detailed Photos
  • Company Information
Overview

Basic Info.

Model NO.
HY
Vacuum Limit
133PA
Brand
Huanyi
Temperature Range
Room Temperature +20~200ºC
Temperature Fluctuation
±0.3ºC
Temperature Change
1.5ºC
Heating Rate Change
5ºC/Min
Transport Package
Strong Wooden Case
Specification
Customized
Trademark
HUANYI
Origin
China
HS Code
9013809000
Production Capacity
10000pieces/Year

Product Description

Product Description

      Nitrogen-filled oven, also known as nitrogen oven, is a kind of hot air oven utilizing gas circulation. Its operation principle is as follows: firstly, the dry articles are put into the nitrogen oven, and then the nitrogen gas is heated to a certain temperature by the heater. The heated nitrogen will generate hot air and transfer the hot air to the dry articles through the airflow. At the same time, the establishment of a closed nitrogen gas circulation system, the hot air from the oven to circulate out, and then through the heater heated and re-circulated into the oven. This cycle makes the hot air to be continuously transferred to the dry articles, so as to achieve fast, even and efficient drying effect. In the whole operation process, the gas inside the nitrogen oven is constantly circulating, and the inertness of nitrogen makes it will not cause any damage to the articles, so as to ensure the quality of the dried articles, special requirements can be added to install a concentration tester to measure the concentration of the atmosphere inside the box. Nitrogen oven for semiconductor manufacturing in silicon, gallium arsenide, lithium niobate, glass and other materials coated with glue before the pretreatment baking, baking after the coating of adhesive firm film baking and display of high-temperature baking; also applies to electronic liquid crystal display, LCD, CMOS, molecular regeneration, medicine, laboratories and other production and scientific research departments: also used for drying of non-volatile and non-flammable and explosive substances, heat treatment, aging and other high-temperature test.

Features

1. The box body is constructed with ceramic fiber heat preservation, offering rapid warming and energy efficiency.
2. The inner liner is subjected to full welding treatment, while the pipeline is fitted with seamless stainless steel pipe fittings, resulting in an oxygen concentration of up to 20PPM.
3. The oven is equipped with air ducts that facilitate forced ventilation, ensuring temperature uniformity of 1.5 ºC%. This uniform drying of materials is further enhanced by a suction port glass fiber filter, which meets the highest standards of cleanliness.
4. The imported temperature control system employs a PID automatic algorithm for precise temperature control, with an accuracy of ± 0.5 ºC.
5. The double flow meter nitrogen saving system and double delay nitrogen filling control feature an oxygen-free environment that greatly reduces nitrogen consumption. The oxygen-free oven can achieve a maximum of 50ppm of oxygen content, thanks to its sealing, nitrogen distribution, air duct design, and exhaust position. These features were designed through digital modeling simulation.
6. The oxygen-free oven door is constructed with a double seal structure, allowing for rapid oxygen reduction, rapid temperature rise and fall.
7. The adjustable inert gas air transportation system includes a flow meter, two-way gas control valve, cycle start high-flow air transportation and low-flow regulation.
8. The use of fiberglass insulation ensures that the cabinet surface temperature remains consistent.
9. The cabinet is equipped with independent over-temperature protection and ground fault protection.

Product Parameters

Vacuum Oven Technical Parameters


Model: HYUO-27 HYUO-72 HYUO-100

Temperature range: +60°C~200°C

Inner box size (WxHxD) cm: 30X30X30 40X45X40 45X50X45

Pressure range: normal pressure ~0.133kpa

Pressure recovery time: s10kpa/min

Cabinet specifications
1. Studio size: W1200mm×D600mm×H600mm (depth×width×height);
2. Air pressure deviation: ±2.5%
3. Vacuuming rate: normal pressure ~ 100kPa, within 10 minutes.
4. The outer dimensions are subject to the actual object.
5. Equipped with a tempered glass window, allowing you to know the status of the products in the box at any time;
6. It is divided into two layers, with two grids and stainless steel mesh, which can be taken out freely;


 
Model Power Control Range  Vacuum limit  Workroom Size(W×H×D)CM 
HYUO-27-200  3KW  60ºC-200ºC  133Pa  30×30×30 
HYUO-72-200  4KW  60ºC-200ºC  133Pa  40×45×40 
HYUO-100-200  5KW  60ºC-200ºC  133Pa  45×45×45 
HYUO-290-200  7KW  60ºC-200ºC  133Pa  60×95×50 
 

Detailed Photos

500L Nitrogen-Filled Drying Oven for Silicon Chip
500L Nitrogen-Filled Drying Oven for Silicon Chip
500L Nitrogen-Filled Drying Oven for Silicon Chip

Company Information

500L Nitrogen-Filled Drying Oven for Silicon Chip500L Nitrogen-Filled Drying Oven for Silicon Chip500L Nitrogen-Filled Drying Oven for Silicon Chip500L Nitrogen-Filled Drying Oven for Silicon Chip500L Nitrogen-Filled Drying Oven for Silicon Chip500L Nitrogen-Filled Drying Oven for Silicon Chip500L Nitrogen-Filled Drying Oven for Silicon Chip500L Nitrogen-Filled Drying Oven for Silicon Chip500L Nitrogen-Filled Drying Oven for Silicon Chip

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