| Customization: | Available |
|---|---|
| After-sales Service: | 1 Year |
| Power Supply: | AC 380V/220V |
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
The Semiconductor Oxygen-Free Oven is designed for durability and high performance. Its high-capacity horizontal air recirculation system maximizes temperature uniformity and performance, making it the ideal industrial baking equipment for a wide range of applications in the semiconductor and electronics industries. The oven is used for handling materials in a controlled inert gas environment, as well as for moisture drying, epoxy curing, and aging of electronic components. Nitrogen-filled oxygen-free ovens provide a controlled and non-flammable nitrogen gas in the chamber to ensure effective heating while protecting samples from oxidation during temperature testing and heat treatment in a non-oxidizing environment.
When the oxygen-free oven is in operation, the working chamber is filled with inert gases CO2 and N2 to prevent materials from being oxidized during baking. This technology is widely used in industry, including IC packaging, LCD, transistors, sensors, diodes, quartz crystal oscillators, hybrid integrated circuit boards, and other applications. This technology is applicable to a wide range of industries, including semiconductors, optoelectronic components, energy materials, communication products, and electromechanical products. It is particularly useful for non-oxidizing drying, curing, soldering, annealing, and other high-temperature treatments.
1.The control system features a PLC and a man-machine interface with microcomputer control thermostat, along with a PID automatic algorithm to ensure that the box temperature remains uniform to within ± 1 ºC.
2. The inner material is made of SUS304 stainless steel, and the entire cavity is welded using argon arc welding to prevent air from entering the oven while saving inert gas.
3. The outer material is made of SPCC steel after soda cleaning, powder baking, and paint treatment. The insulation material is high-density fiber cotton, which provides excellent heat preservation.
4. The upper and lower furnace chambers can be individually temperature-controlled, ventilated, alarmed, and supplied with forced air for internal circulation, ensuring uniform temperature.
5. Configuration of automatic nitrogen filling device and automatic opening and closing of the dampers for nitrogen baking.
6. The ability to save the formula, view the temperature curve, export temperature rise data, etc.
7. Adjustable wind speed to accommodate varying product categories.
8. The use of fiberglass insulation ensures that the cabinet surface temperature is maintained at an optimal level.
9. The unit is equipped with independent over-temperature protection and ground fault protection.
10. The high-capacity horizontal air recirculation system and electric heating system ensure that performance temperature uniformity is achieved.
Vacuum Oven Technical Parameters
| Model | Power | Control Range | Vacuum limit | Workroom Size(W×H×D)CM |
| HYUO-27-200 | 3KW | 60ºC-200ºC | 133Pa | 30×30×30 |
| HYUO-72-200 | 4KW | 60ºC-200ºC | 133Pa | 40×45×40 |
| HYUO-100-200 | 5KW | 60ºC-200ºC | 133Pa | 45×45×45 |
| HYUO-290-200 | 7KW | 60ºC-200ºC | 133Pa | 60×95×50 |
){kind=link}